1964_IMPORT_AND_EXPORT_(STRATEGIC_COMMODITIES)_REGULATIONS — Page 29

1988 Ed.]

Import and Export (Strategic Commodities) Regulations

[CAP. 60

G 29

[Subsidiary]

IL 1356

(6) Projection image transfer for processing slices (wafers) of $0.8 mm

(2 inches) or larger in diameter;

N.B.

Non-contacting (proximity) image transfer equipment is embargoed only by (1) to (5) above.

(g) Electron beam, ion beam, or X-ray equipment for projection image

transfer;

(For laser equipment, see Note 1 above).

(h) Photo-optical or non-photo-optical step and repeat or partial field

equipment for the transfer of the image onto the wafer;

(7) Mask contact image transfer equipment for imaging a field larger than

76.2 x 76.2 mm (3 × 3 inches).

(5) Equipment embargoed by sub-item (b)(4) above is defined as follows-

(a) Specially designed for the measurement of oxygen or carbon content in

semiconductor materials;

(b) Equipment for concurrent etching and doping profile analysis (employing

capacitance-voltage or current-voltage analysis techniques);

(c) Equipment for line-width measurement with a resolution of 1.0 micro-

metre or finer;

(d) Specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 micrometres or less with a resolution of 1.0 micrometre or finer.

(6) Equipment embargoed by sub-item (b)(5) above is defined as follows-

(a) “Stored-programme controlled" die (chip) mounters and bonders with a positioning accuracy finer than 50 micrometres or incremental steps finer than 6.4 micrometres;

(b) "Stored-programme controlled" wire bonders and welders for performing

consecutive bonding operations;

(c) Equipment for producing multiple bonds in a single operation (e.g. beam

lead bonders, chip carrier bonders, tape bonders).

(d) Semi-automatic or automatic hot cap sealers, in which the cap is heated locally to a higher temperature than the body of the package, specially designed for ceramic microcircuit packages embargoed by Item 1564(b) and which have a throughput equal to one package per minute or more.

N.B.

1. General purpose resistance type spot welders are not covered by sub-item IL1355(b)(5).

2. Thermal compression bonders, also known as nailhead bonders, are embargoed under the terms of this item.

(7) Equipment covered by sub-item (b)(6) above is defined as that which has any

of the following

(a) Positioning accuracy finer than 50 micrometres, or incremental steps finer

than 6.4 micrometres;

(b) Individual die location read-out (X-Y position information) during

testing;

(c) Capability of testing devices having more than a total of 24 terminals;

(d) Automatic slice (wafer) alignment.

(8) Not used.

(9) Not used.

Equipment specially designed or incorporating modifications for the continuous coating of polyester-base magnetic tape embargoed by Item IL1572, and specially designed components therefor.

Note:

This Item does not embargo general purpose continuous coating equipment.