1988 Ed.]
Import and Export (Strategic Commodities) Regulations
[CAP. 60
G 29
[Subsidiary]
IL 1356
(6) Projection image transfer for processing slices (wafers) of $0.8 mm
(2 inches) or larger in diameter;
N.B.
Non-contacting (proximity) image transfer equipment is embargoed only by (1) to (5) above.
(g) Electron beam, ion beam, or X-ray equipment for projection image
transfer;
(For laser equipment, see Note 1 above).
(h) Photo-optical or non-photo-optical step and repeat or partial field
equipment for the transfer of the image onto the wafer;
(7) Mask contact image transfer equipment for imaging a field larger than
76.2 x 76.2 mm (3 × 3 inches).
(5) Equipment embargoed by sub-item (b)(4) above is defined as follows-
(a) Specially designed for the measurement of oxygen or carbon content in
semiconductor materials;
(b) Equipment for concurrent etching and doping profile analysis (employing
capacitance-voltage or current-voltage analysis techniques);
(c) Equipment for line-width measurement with a resolution of 1.0 micro-
metre or finer;
(d) Specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 micrometres or less with a resolution of 1.0 micrometre or finer.
(6) Equipment embargoed by sub-item (b)(5) above is defined as follows-
(a) “Stored-programme controlled" die (chip) mounters and bonders with a positioning accuracy finer than 50 micrometres or incremental steps finer than 6.4 micrometres;
(b) "Stored-programme controlled" wire bonders and welders for performing
consecutive bonding operations;
(c) Equipment for producing multiple bonds in a single operation (e.g. beam
lead bonders, chip carrier bonders, tape bonders).
(d) Semi-automatic or automatic hot cap sealers, in which the cap is heated locally to a higher temperature than the body of the package, specially designed for ceramic microcircuit packages embargoed by Item 1564(b) and which have a throughput equal to one package per minute or more.
N.B.
1. General purpose resistance type spot welders are not covered by sub-item IL1355(b)(5).
2. Thermal compression bonders, also known as nailhead bonders, are embargoed under the terms of this item.
(7) Equipment covered by sub-item (b)(6) above is defined as that which has any
of the following
(a) Positioning accuracy finer than 50 micrometres, or incremental steps finer
than 6.4 micrometres;
(b) Individual die location read-out (X-Y position information) during
testing;
(c) Capability of testing devices having more than a total of 24 terminals;
(d) Automatic slice (wafer) alignment.
(8) Not used.
(9) Not used.
Equipment specially designed or incorporating modifications for the continuous coating of polyester-base magnetic tape embargoed by Item IL1572, and specially designed components therefor.
Note:
This Item does not embargo general purpose continuous coating equipment.