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FAN LAU AND ITS FORT: AN HISTORICAL PERSPECTIVE

ARMANDO M. DA SILVA*

Site and Situation

Fan Lau is located at the extreme southwestern tip of Tai Yu Shan or Lantau Island. It is almost equal in distance from Hong-kong and Macau and it is situated about twenty-five miles due east of the latter. Fan Lau can be reached by sampan or fishing boat either from the market towns of Cheung Chau or Tai O, or by walking along the water catchment from Shek Pik reservoir to a point above and beyond Kau Ling Chung, and then by descending a steep stony path towards the settlement. Another route is to strike out from Tai O, taking the coastal footpath through Yi O, and thence to Fan Lau. There is no motor road to Fan Lau.

The area of Fan Lau includes a headland known as Kai Yik Kok (†) meaning "chicken wing point" where an old fort is located (see map 1).† The high point of the Kai Yik Kok promontory rises to about 380 feet above sea level. In the north of this headland lies the cultivated waist of Fan Lau where a small settlement is located. Looming above the settlement is Kai Yik Shan1 from which two streams supply irrigation water to the padi fields. Two fine beaches, Tung Wan and Sai Wan, flank the waist of the peninsula. Tung Wan, though exposed to prevailing easterly winds and a long fetch from the village, can accommodate deep-draught junks.

The actual territory associated with the village extends beyond the physical boundaries of the settlement. Fan Lau villagers, for example, cultivate fields located in Tsin Yue Wan (see map 1) and records show that, at least in 1904, padi fields in Kau Ling Chung (since abandoned) were also cultivated.

Situated at the entrance of the Chu Kong or Pearl River estuary, Fan Lau enjoyed a strategic location in the past. This position was reflected in the construction of numerous forts and guard stations

* Mr. da Silva has a Master's degree from the University of California at Berkeley and is at present with the Department of Geography, University of Hawaii.

† Maps 1-4 are located at pp. 92-95.

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