1988 Ed.]
Import and Export (Strategic Commodities) Regulations
[CAP. 60
G 87
[Subsidiary]
(2) Ceramic "substrates" having no more than two layers of interconnections, including the ground plane; or
(3) Copper foil having a thickness of 18 micrometre (0.00071 inch) or more;
(b) Ceramic packages for integrated circuits which are designed for hermetically sealed pin or pad grid array, leadless carrier or surface-mounted configurations, except when having all of the following characteristics:
(1) Single-in-line, dual-in-line or flat-pack configuration;
(2) Pin, pad or lead spacings of 2.50 mm or more, or 100 mil or more; and (3) 40 leads or less;
(c) "Assemblies", "modules" and printed circuit boards with mounted components, with any of the following characteristics:
(1) They include "substrates" for printed circuit boards embargoed by sub-item (a) above; or
(2) They contain embargoed components, except when:
(A) The only embargoed components they contain are capacitors;
(B) They are power supply "assemblies";
(C) They are non-coherent light-emitting alphanumeric displays, of which incorporated "monolithic integrated circuits" having both the following characteristics:
(a) Used for decoding, controlling or driving the display; and
(b) Not integral with the actual display device; or
(D) They are simple encapsulated photo-coupler (transopter) "assemblies", having both of the following characteristics:
Note:
(a) Electrical input and output; and
(b) Any incorporated light-emitting diode can only emit non-coherent light;
Sub-item (c) (2) does not embargo "assemblies", "modules" or printed circuit board with mounted components, having both of the following characteristics: (a) Designed for equipment not embargoed by any other Item of these Lists; and
(b) Substantially restricted to the particular application for which they have been designed by nature of either:
Notes:
1.
2.
(1) Design;
(2) Performance;
(3) Lack of "user-accessible microprogrammability";
(4) Lack of "user-accessible programmability"; ("Software";
6) "Microprogramme" control; or
7) Specialized logic control.
For the embargo status of "assemblies", "modules" or printed circuit boards with mounted components which are designed for, or which have the same functional characteristics as electronic computers or "related equipment", see
Item IL 1565.
"Assemblies", "modules" or printed circuit boards with mounted components which are designed for, or which have the same functional characteristics as embargoed equipment shall be rated against the parameters of the appropriate equipment Item. In such cases, however, the relevant temperature parameters have to be changed into: below 218K (-55°C) or above 358K (85°C).
(d) "Monolithic integrated circuits", "microcomputer microcircuits", "microprocessor microcircuits", "multichip integrated circuits", "film type integrated circuits", "hybrid integrated circuits" and "optical integrated circuits", except: