G 24
CAP. 60]
Import and Export (Strategic Commodities) Regulations
[1988 Ed.
[Subsidiary]
IL 1355
(d) "Stored-programme controlled" inspection equipment for the detection of defects in printed circuit boards using optical pattern comparison or other machine scanning techniques;
(e) "Stored-programme controlled" electrical test Equipment for the identification of open and short circuits on bare printed circuit boards, capable of—
(1) Continuity testing (less than or equal to 4 ohm) at a rate of 2,500 or more measurements per second; or
(2) High voltage testing (greater than or equal to 50 volts) at a rate of 10,000 or more measurements per minute;
("Stored-programme controlled" multi-spindle drills and routers having any of the following characteristics
(1) Absolute positioning accuracy of ±10 micrometres (0.0004 inch) or better; (2) Minimum time needed for drill bit changes less than or equal to 5 seconds; or (3) X and Y positioning speeds higher than or equal to 0.125 m/sec (300 inch/min) for drilling or for routing,
(g) "Stored-programme controlled" cyclic voltametric stripping equipment specially designed for printed circuit board plating bath monitoring and analysis.
Technical Note:
"Stored-programme controlled" is defined as a control using instructions stored in an electronic storage which a processor can execute in order to direct the performance of predetermined functions.
N.B.
Equipment may be "stored-programme controlled" whether the electronic storage is internal or external to the equipment.
Note:
See also Item IL 1522(b) for the embargo of printed circuit board manufacturing equipment incorporating a laser.
Equipment for the manufacture or testing of electronic components and materials, as follows, and specially designed components, accessories and "specially designed software" therefor-
(a) Equipment specially designed for the manufacture or testing of electron tubes, optical elements and specially designed components therefor embargoed by Items IL 1541, 1542, 1555, 1556, 1558 or 1559;
(b) Equipment specially designed for the manufacture or testing of semiconductor devices, integrated circuits and "assemblies", as follows, and systems incorporating or having the characteristics of such equipment-
(1) Equipment for the processing of materials for the manufacture of devices and components as specified in the heading of this sub-item;
Note:
This item does not embargo quartz crucibles specially designed for equipment embargoed by (b)(1);
(2) Masks, mask substrates, mask-making equipment and image-transfer equipment for the manufacture of devices and components as specified in the heading of this sub-item;
Technical Note:
The term "masks" refers to those used in electron beam lithography, X-ray lithography, and for ultra-violet lithography, as well as the usual ultra-violet and visible photolithography.
(3) "Stored-programme controlled" inspection equipment for the detection of defects in processed wafers, substrates or chips using optical pattern comparison or other machine scanning techniques;
Technical Note:
Conventional scanning electron microscopes, except when specially designed and instrumented for automatic pattern inspection, are not embargoed by this sub-item.