1.
Background
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In 1985 work started in WIPO on the elaboration of a draft treaty on
the protection of intellectual property in respect of integrated
circuits. In September 1987 the Governing Bodies of WIFO decided
that a Diplomatic Conference should be convened during the biennium
1988-1989. A meeting of all stateo members of WIPO and the Paris
Union decided on 1.6.1988 that the Conference should take place in
Washington from 8 to 26 May 1989.
Preparations for the Conference were undertaken by a fourth session
of the Committee of Experts and a preparatory meeting from 7 November
to 22 November 1988 In Geneva. The preparatory meeting decided that
the European Community will be invited to the Diplomatic Conference.
However, the question of its status at the Conference will only be
decided finally by the Conference Itself. Subject to such a
decision, the draft rules of procedure for the Conference attribute
the status of a member delegation to the EEC, i.e. the same status as
that of a stata membar of Wino ar the Pario or Barne Unions. Whether
the Community will have the right to vote in place of the Member
States is not prejudgod by the status of Member delegation, and this
will have to be decided separately by the Diplomatic Conference upon
adoption of the rules of procedure.
2.
Objectives of the future Treaty
The basic aim of the future treaty is to protect layout-designs of
integrated circuits against unauthorized copying and possible trade
In microchips incorporating unauthorized copies of such protected
layout-designs.
The futura treaty will contain the principle of national treatment.
Such a treaty would thus provide protection for all persons from