1964_IMPORT_AND_EXPORT_(STRATEGIC_COMMODITIES)_REGULATIONS — Page 96

G 96

CAP. 601

Import and Export (Strategic Commodities) Regulations

[1988 Ed.

[Subsidiary]

(d) "Monolithic integrated circuits" having all of the following characteristics:

(1) No "user-accessible microprogrammability";

(2) Not utilizing charge-coupled device (CCD) technology;

(3) Not intended for beam lead bonding; and

(4) Designed or programmed by the "manufacturer" for any of the following applications, only:

(A) Timekeeping applications (e.g., watches or clocks); or

(B) Cardiac pacemakers or hearing aids;

(e) Amplifier "monolithic integrated circuits" as follows:

(1) Audio amplifiers, having a maximum rated power output of 25 W or less at an ambient temperature of 298K (25°C); or

(2) Operational amplifiers, having all of the following characteristics:

(A) A typical unity-gain open-loop bandwidth of no more than 5 MHz,

(B) A typical open-loop voltage gain of no more than 562,000 i.e., 115 dB;

(C) A maximum intrinsic rated input offset voltage of no less than 2.5 mV; and

(D) A typical slew rate at unity-gain not exceeding 2.5 V/microsecond;

(f) Voltage "monolithic integrated circuits" as follows:

(1) Voltage comparators, having both of the following characteristics:

(A) A maximum input offset voltage of no less than 5 mV; and

(B) A "typical switching speed", i.e., typical response time of no less than 50 ns.

(2) Linear type voltage regulators, having both of the following characteristics:

(A) A rated nominal output voltage of 40 V or less; and

(B) A maximum output current of 1 A or less; or

(3) Switching type voltage regulators, having both of the following characteristics:

(A) A rated nominal output voltage of 40 V or less; and

(B) A maximum output current of 150 mA or less;

(4) Encapsulated integrated circuits having all of the following characteristics:

(A) Not designed or rated as radiation hardened;

Notes:

(B) Not rated for operation at an ambient temperature below 233K (-40°C) or above 358K (85°C);

(C) Packaged in hermetically sealed ceramic packages excluded from embargo under sub-item (b) above; and

(D) Containing unencapsulated integrated circuits excluded from embargo under sub-item (d) above.

1. Nothing in the above shall be construed as permitting the export of wafer or chip design or processing information inherent in the manufacture of any embargoed class of "assembly", "module", integrated circuit or "circuit element", irrespective of any release of devices in any of these classes. This restriction also applies to technology embodied both in the equipment embargoed by Item IL1355 and in its use.