1964_IMPORT_AND_EXPORT_(STRATEGIC_COMMODITIES)_REGULATIONS — Page 86

G 86

CAP. 60]

Import and Export (Strategic Commodities) Regulations

[1988 Ed.

[Subsidiary]

IL 1561

IL 1564

Materials specially designed and manufactured for use as absorbers of electromagnetic waves having frequencies greater than 2 × 108 Hz and less than 1012 Hz, except materials as follows-

(i) "Hair" type absorbers, whether constructed of natural or synthetic fibres, with non-magnetic loading to provide absorption;

(ii) Absorbers whose incident surface is non-planar in shape, including pyramids, cones, wedges and convoluted surfaces, and which have no magnetic loss; and

(iii) Absorbers having all of the following characteristics:

Note:

(1) Made of:

(a) Plastic foam materials (flexible or non-flexible) with carbon-loading to provide absorption; or

(b) Organic binders with magnetic material loading which do not provide "broad-band absorption performance with low reflectivity”;

Technical Note:

"Broad-band absorption performance with low reflectivity" is defined as less than 5 per cent echo compared with metal over a bandwidth greater than ±15 per cent of the centre frequency of the incident energy;

(2) The incident surface is planar;

(3) Their tensile strength is less than 7 × 106 N/m2 (1,016 psi);

(4) Their compressive strength is less than 14 × 106 N/m2 (2,032 psi); and

(5) They cannot withstand more than 450K (177°C, 350°F).

Nothing in the above releases magnetic materials to provide absorption when contained in paint.

“Assemblies" of electronic components, "modules", printed circuit boards with mounted components, “substrates" and integrated circuits, including packages therefor, as follows--

Note:

Integrated circuits are categorized as follows:

"monolithic integrated circuits"

"microcomputer microcircuits"

"microprocessor microcircuits"

"multichip integrated circuits"

"film type integrated circuits"

"hybrid integrated circuits”

"optical integrated circuits"

For a list of definitions of terms used in this Item, see Technical Note below.

(a) "Substrates" for printed circuit boards, including ceramic "substrates" and coated metal “substrates" (single-sided, double-sided or multilayer) and thin copper foils therefor, except:

(1) Printed circuit boards manufactured from any of the following materials:

(A) Paper base phenolics;

(B) Glass cloth melamine;

(C) Glass epoxy resin uncoated or coated with copper foil of a thickness of 18 micrometre (0.00071 inch) or more;

(D) Polyethylene terephthalate; or

(E) Any other insulating material having all of the following characteristics:

(a) A maximum continuous rated operating temperature not exceeding 423K (150°C);

(b) A dissipation factor equal to or more than 0.009 at 1 MHz;

(c) A relative dielectric constant equal to or less than 8 at 1 MHz, and

(d) A coefficient of expansion equal to or more than ±10-5/K over a temperature range of 273K to 393K (0°C to 120°C);