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Approved
Feb. 17.89. Advance copy
Working Paper of the Commission Services
Subject: Semiconductor Topography Protection
Diplomatic Conference WIPO May 8-26, 1989.
Reply to the questions concerning the proposal made by Greece on behalf
of the Member States of the European Communities to permit the European
Economic Community (EEC) to become party to the future WIPO treaty on integrated circuits. (1) This reply is to be submitted to the World
Intellectual Property Organisation (WIPO) for circulation to delegations
invited to the Diplomatic Conference convened at Washington in May 1989.
The present paper confirms the answers already given to the questions
which were raised during the 4th meeting of the Committee of Experts in
November 1988 and explains in more detail the consequences for other
States if both the EEC and its Member States become party to a treaty in
order to comply with internal engagements undertaken by the Member States
of the EEC.
(1) Vide paragraph 198 of the Report (see footnote 2). The majority of
delegations requested that the European Communities prepare a formal
paper for transmission to the International Bureau as soon as possible,
and for distribution by the International Bureau, which would deal with
the questions raised during the meeting and any other considerations
which would favor and facilitate the possibility of the European
Communities becoming party to the proposed treaty."
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Private notes are available after approval.